- AUTOCUTS
- CCD camera
- CryoMatrix® holey Grid
- Magnetic Field Cancelling System
- Vibration Isolation System
- HATA-Holder System
- PIE plasma cleaners
- Nexperion SentineL
- WET-SEM
- Temassist-Towards Automatic TEM solutions
- FEG and LaB6 filament
- Compressors
- Chiller
- Vacuum System
- High-vacuum Optical Platform for cryo-CLEM
- Quick Freeze Substitution Equipment
- Agar Auto Sputter Coater
- Coating instrument
- Cryo-FIB sample preparation
- Nanometer Pattern Generation System
Product Details
The Agar high resolution sputter coater offers real solutions to the problems encountered when coating difficult samples for FEG-SEM. In order to minimise the effects of grain size the high resolution coater offers a full range of target materials with unprecedented control over thickness and deposition conditions. To minimise charging effects in the SEM, the stage design and wide range of operating pressures allows precise control of the uniformity of the coating. The high/low chamber configuration allows easy adjustment of working distance.
Sputter Chamber
Two alternative height 150 mm diameter pyrex work chambers are provided. This enables the working distance to be readily changed. The motorised specimen stage has four holders which move in a non- repetitive rotary planetary motion. A choice of 4 speeds are available and the specimen platform can be tilted from 0-90°. Specimen tables can be selected to suit a wide range of standard SEM stubs.
Sputter Head
The hinged top-plate contains the “cool” planar magnetron head. Chromium and platinum/palladium targets are provided as standard. A wide range of other target materials is also available. Targets are readily interchangeable.
Control System
The complete operating cycle including pumping, argon flushing, timing and venting is carried out under
micro-processor control with user defined inputs to select the sputtering current and coating time. The sputter current is set on a digital programmer and is independent of the argon pressure in the chamber. Alternatively the integrated film thickness monitor can be used to terminate the sputtering process when the desired thickness has been reached.The precision argon leak valve is solenoid operated and gas pressure can be closely controlled. Pumping System
The system is pumped by a turbo-molecular drag pump backed by a rotary pump. The turbo-molecular drag pump is bolted to the main chassis and the rotary pump complete with anti-vibration platform is designed to sit on the bench behind the main unit. The system is designed to achieve a vacuum of 1 x 10-3 mb in 1 minute with a base pressure of 1 x 10-5 mb. The high capacity pumping system in combination with the precision leak valve provide the gas handling capability necessary for use with non noble metal targets.
Technical specifications
Chamber size: 120mm dia x 120mm high
Chamber size for SE: 150mm dia x 165mm high
Sputter target: Gold target
Au / PD or PT optional
Sample table: 12 SEM Sample table
Sputter supply: Microprocessor based safety interlocked variable, 40mA max.
Sputter head: Low voltage planar magnetron type with quick change target wrap-around dark-space shield
Analog metering: Vacuum atmosphere - 0.001mb
Current 0-50mA
Dimensions: 420mm dia x 295mm high
Weight: 10Kgs
Thickness control: Use terminating film thickness monitor(Option)
Control method: Automatic operation of gas purge and leak functions
Automatic process sequencing
Full manual overide
Digital timer (0-300 sec) with pause
Automatic vent
Pumping System
Rotary pump: high speed, 2 stage
Pumping speed: 2.0/2.4 cu.m/hr (50/60Hz）
0.1mb is 25/30 sec
Bench top system: Vacuum pump is mounted on benchtop compatible anti-vibration table with stainless steel bellows coupling system
Dimensions: 330mm dia x 215mm high
Weight: 14Kgs
Services required
Supply: 100 - 120 or 200 - 240 VAC, 50/60Hz
Power: 175 VA max.
Argon gas: 99.9%pure argon
Pressure, regulated 7 - 8 psi (0.5 - 0.6 bar) Hose connection, 6.0mm (¼")
Product appearance
